Electronic package and manufacturing method thereof
US12057409B2 · kind B2 · utility
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1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Aug 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.