Patent · US Active

Methods and apparatus for cleaning semiconductor wafers

US12062556B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Fuping Chen · Shanghai, CN
Xiaoyan Zhang · Shanghai, CN
Hui Wang · Shanghai, CN

Key dates

Filing date	Apr 27, 2018
Grant date	Aug 13, 2024
Priority date	—
Expiry date	Aug 12, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68764
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

Related to is a method for cleaning an in-process wafer. The method includes causing the in-process wafer to be rotated, causing function water to be applied to a surface of the rotated in-process wafer to generate a flowing function water film on the rotated in-process wafer, causing the surface of the in-process wafer to be cleaned by a sonic device for a first period, causing the sonic device to be lifted and/or rotation speed of the rotated in-process wafer to be accelerated to separate the sonic device from the flowing function water film, causing the function water to be applied to the surface of the rotated in-process wafer for a second period after separating the sonic device from the function water film, and causing the surface of the in-process wafer to be dried.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.