Integrated circuit packages with thermal interface materials with different material compositions
US12062592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2019 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Dec 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.