Packaged electronic device having integrated antenna and locking structure
US12062833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2023 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Apr 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.