Hyung Jun Cho
24Patents
2h-index
27Co-inventors
53Inventor score
Filing activity: Feb 9, 2012 → Oct 29, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9966652B2 | Packaged electronic device having integrated antenna and locking structure | Electricity | 5 | Active |
| US10778175B2 | Coupler circuit with phase compensation function | Electricity | 3 | Active |
| US10886058B2 | Inductor and low-noise amplifier including the same | Electricity | 2 | Active |
| US10979007B2 | Amplification device with isolation characteristics | Electricity | 2 | Active |
| US9509375B2 | Wireless transceiver circuit with reduced area | Electricity | 2 | Active |
| US9907157B2 | Noise blocking printed circuit board and manufacturing method thereof | Electricity | 1 | Active |
| US10686413B2 | Low noise amplifier circuit with multiple-input multiple-output (MIMO) structure | Electricity | 1 | Active |
| US9455190B2 | Semiconductor apparatus having TSV and testing method thereof | Electricity | 1 | Active |
| US10903799B2 | Variable gain low noise amplifying apparatus with phase distortion compensation | Electricity | 1 | Active |
| US11694946B2 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Electricity | 1 | Active |
| US10826442B2 | Variable gain low noise amplifier with phase compensation | Electricity | 1 | Active |
| US10826151B2 | Directional coupler circuit and power amplifying device with phase compensation function | Electricity | 0 | Active |
| US12406864B2 | Susceptor | Electricity | 0 | Active |
| US12300584B2 | Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof | Electricity | 0 | Active |
| US11417589B2 | Semiconductor device and a method of manufacturing a semiconductor device | Electricity | 0 | Active |
| US10164470B2 | Wireless power transmission circuit | Electricity | 0 | Active |
| US11521918B2 | Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof | Electricity | 0 | Active |
| US11151802B2 | Method and system for providing a face adjustment image | Physics | 0 | Active |
| US12062833B2 | Packaged electronic device having integrated antenna and locking structure | Electricity | 0 | Active |
| US12087676B2 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Electricity | 0 | Active |
| US11915998B2 | Semiconductor device and a method of manufacturing a semiconductor device | Electricity | 0 | Active |
| US9467197B2 | Front end circuit | Electricity | 0 | Active |
| US11677135B2 | Packaged electronic device having integrated antenna and locking structure | Electricity | 0 | Active |
| US10840169B2 | Semiconductor device and a method of manufacturing a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.