Patent · US Active

Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

US12063751B2 · kind B2 · utility

0Cited by

3References

19Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Akif Özkök · Berlin, DE
Bert Reents · Berlin, DE
Mustafa Özkök · Berlin, DE
Marko Mirkovic · Berlin, DE
Markus Youkhanis · Berlin, DE
Horst Brüggmann · Berlin, DE
Sven Lamprecht · Berlin, DE
Kai-Jens Matejat · Berlin, DE

Key dates

Filing date	Aug 19, 2020
Grant date	Aug 13, 2024
Priority date	—
Expiry date	Jan 19, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1492
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.