Marko Mirkovic
2Patents
0h-index
11Co-inventors
25Inventor score
Filing activity: Aug 19, 2020 → Aug 19, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12063751B2 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Electricity | 0 | Active |
| US12245383B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.