Apparatus and method for cleaning semiconductor wafers

US12068149B2 · kind B2 · utility

Assignee

• ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

• Hui Wang · Shanghai, CN
• Zhiyou Fang · Shanghai, CN
• Jun Wu · Shanghai, CN
• Guanzhong Lu · Shanghai, CN
• Fuping Chen · Shanghai, CN
• Jian Wang · Rosharon, US
• Jun Wang · Nanhu, CN
• Deyun Wang · Taizhou City, CN

Key dates

• Filing date: Jun 7, 2018
• Grant date: Aug 20, 2024
• Expiry date: Apr 12, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67781
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention provides an apparatus for cleaning semiconductor wafers. The apparatus includes at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; one or more single wafer cleaning modules, configured to implement single wafer cleaning and drying processes; a plurality of robots, configured to transfer one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules; and a controller, configured to control the plurality of robots to transfer the one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules.