Substrate processing apparatus, mixing method, and substrate processing method
US12068175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes: generating a mixture liquid by mixing a phosphoric acid aqueous solution with an additive that suppresses precipitation of silicon oxide in a tank and circulating the mixture liquid through a circulation path that exits and returns to the tank, the circulation path including a back pressure valve; sending the mixture liquid to a processing bath through a liquid path diverging from the circulation path and positioned upstream from the back pressure valve; and supplying a silicon-containing compound aqueous solution to the mixture liquid generated in the generating. The back pressure valve is fully open in the generating and throttled in the sending. A substrate processing apparatus includes a processing bath, a mixing device, a liquid path, and a silicon solution supply.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.