Dummy die structures of a packaged integrated circuit device

US12068222B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Mitul Modi · Phoenix, US
• Joseph Van Nausdle · Chandler, US
• Omkar G. Karhade · Chandler, US
• Edvin Cetegen · Chandler, US
• Nicholas S. Haehn · Scottsdale, US
• Vaibhav Agrawal · Chandler, US
• Digvijay A. Raorane · Chandler, US
• Dingying Xu · Chandler, US
• Ziyin Lin · Chandler, US
• Yiqun Bai · Chandler, US

Key dates

• Filing date: Sep 25, 2020
• Grant date: Aug 20, 2024
• Expiry date: Dec 19, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled to a surface thereof. A dummy die, adjacent to an IC die and coupled to a region of the substrate, comprises a polymer resin and a filler. A package mold structure of the packaged device adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate. In another embodiment, a first CTE of the dummy die is less than a second CTE of the package mold structure, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the package mold structure.