Integrated circuit package with serpentine conductor and method of making
US12068232B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Mar 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package includes a one or more die and an interposer. The interposer is coupled to the die and includes circuit traces. The circuit traces are provided in a serpentine configuration. A method can be used to fabricate an integrated circuit package. The method can use an interposer circuit traces having a configuration that allows the circuit traces to deform under stress, and return to an original state undamaged more readily than a straight conductive trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.