System and method for repairing vacancies resulting from mass transfer of devices
US12068430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Jan 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method utilizes a target substrate has an array of chips on a carrier with a plurality of vacancies and a plurality of donor coupons are incompletely filled with functional chips. A bounding box is defined that encompasses the vacancies on the target substrate. Outcomes are simulated by overlapping a representation of the bounding box over a representation of each of a plurality of donor coupons at a plurality of translational offsets on a substrate plane to determine matches. An optimal one of the outcomes is found at a selected one or more of the donor coupons corresponding one or more offsets. A parallel transfer of the matching functional chips fills the vacancies on the target substrate using the one or more selected donor coupons and corresponding one or more offsets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.