Yunda Wang
14Patents
2h-index
22Co-inventors
46Inventor score
Filing activity: Oct 28, 2015 → Jul 12, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9921004B2 | Polymer-based microfabricated thermal ground plane | Performing Operations; Transporting | 12 | Active |
| US9952082B2 | Printed level sensor | Physics | 9 | Active |
| US10403439B2 | Multilayer capacitor | Electricity | 1 | Active |
| US10964582B2 | Transfer substrate utilizing selectable surface adhesion transfer elements | Electricity | 1 | Active |
| US12297538B2 | High registration particles-transferring system | Electricity | 0 | Active |
| US11348905B2 | Method and system for assembly of micro-LEDs onto a substrate | Electricity | 0 | Active |
| US12068430B2 | System and method for repairing vacancies resulting from mass transfer of devices | Electricity | 0 | Active |
| US11732362B2 | High registration particles-transferring system | Electricity | 0 | Active |
| US11302561B2 | Transfer elements that selectably hold and release objects based on changes in stiffness | Electricity | 0 | Active |
| US11785705B2 | Thermal insulation and temperature control of components | Electricity | 0 | Active |
| US10460878B2 | Multilayer capacitor | Electricity | 0 | Active |
| US10604843B2 | High registration particles-transferring system | Electricity | 0 | Active |
| US10917963B2 | Thermal insulation and temperature control of components | Electricity | 0 | Active |
| US10470292B2 | Thermal insulation and temperature control of components | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.