Patent · US Active

Forming conformable layer with flap on semiconductor devices

US12068443B1 · kind B1 · utility

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19Claims

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Assignee

Meta Platforms Technologies, LLC · US

Inventors

Oscar Torrents Abad · Cork, IE
Tilman Zehender · Cork, IE
Pooya Saketi · Cork, IE
Karsten Moh · Riegelsberg, DE

Key dates

Filing date	Sep 9, 2021
Grant date	Aug 20, 2024
Priority date	—
Expiry date	Sep 28, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/852
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments relate to forming an elastomeric interface layer (elayer) with a flap over multiple light emitting diode (LED) dies by forming materials across multiple LED dies and removing the materials between the LED dies. The formed flap of the elayer provides a large surface area for adhesion between each LED and a pick-up surface. For example, the flap may have a surface area that is larger than the light emitting surface of the LED die, or larger than the surface area of an elastomeric interface layer without the flap. As such, the elayer allows each LED to be picked up by a pick-up surface and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (μLED) dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.