Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
US12068535B2 · kind B2 · utility
1Cited by
1References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/241
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.