Polymer substrate design parameters for electronic microfabrication
US12071533B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Dec 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.