Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device
US12072251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2022 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Mar 1, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2203/13
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.