Resist underlayer film-forming composition including cyclic carbonyl compound
US12072630B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2019 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Aug 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0276
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resist underlayer film-forming composition formed into a flat film which can exhibit high etching resistance, a good dry etching velocity ratio and a good optical constant, has a good covering property even against a so-called step-structure substrate, and has a small film thickness difference after being embedded. Also, a method for producing a polymer suitable for the resist underlayer film-forming composition; a resist underlayer film using the resist underlayer film-forming composition; and a method for manufacturing a semiconductor device. A resist underlayer film-forming composition containing a reaction product of an aromatic compound having 6 to 60 carbon atoms with a carbonyl group in a cyclic carbonyl compound having 3 to 60 carbon atoms and a solvent, wherein the reaction product has such a structure that one of the carbon atoms in the cyclic carbonyl compound links two molecules of the aromatic compound to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.