Stress analysis device
US12073549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2022 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30108
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.