Hard IP blocks with physically bidirectional passageways
US12074092B2 · kind B2 · utility
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134References
18Claims
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Assignee
Inventor
Key dates
| Filing date | Feb 10, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Apr 16, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Hard IP blocks, such as SerDes chips, are designed with keepout zones beneath the surface interconnects, the keepout zones being spaces within the chip where there is no circuitry. Connections can be formed between surface interconnects on an under surface of the SerDes chip that faces the host die, and surface interconnects on an upper surface of the SerDes chip that interfaces without external devices. Accordingly, redistribution layers routing around an outer periphery of the SerDes chip are no longer needed, and the resistive capacitive load remains low so as not to adversely impact transmitted signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.