Embedding component in component carrier by component fixation structure
US12075561B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Nov 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a component carrier includes providing a base structure having a main surface that is at least partially covered by a component fixation structure; providing a component, the component intrinsically comprising warpage; mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; and fixating the component to the component carrier through the component fixation structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.