Custom leadframe from standard plus printed leadframe portion
US12080633B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Mar 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.