Patent · US Active

Semiconductor device module having vertical metallic contacts and a method for fabricating the same

US12080669B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Edward Fuergut · Nuremberg, DE
Martin Gruber · Schwandorf, DE
Petteri Palm · Regensburg, DE
Bernd Schmoelzer · Radenthein, AT
Wolfgang Scholz · Minden, DE
Mark A. Thomas · Solihull, GB

Key dates

Filing date	Sep 23, 2021
Grant date	Sep 3, 2024
Priority date	—
Expiry date	Mar 11, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10416
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device module includes a package carrier having an opening, wherein in the opening there is disposed a semiconductor package including a semiconductor die, an encapsulant, and first vertical contacts, wherein the encapsulant at least partially covers the semiconductor die, and the first vertical contacts are connected to the semiconductor die and extend at least partially through the encapsulant, and a first outer metallic contact layer electrically connected to the first vertical contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.