Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
US12080672B2 · kind B2 · utility
0Cited by
151References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2020 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | May 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonded structure can comprise a first element and a second element. The first element has a first dielectric layer including a first bonding surface and at least one first side surface of the first element. The second element has a second dielectric layer including a second bonding surface and at least one second side surface of the second element. The second bonding surface of the second element is directly bonded to the first bonding surface of the first element without an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.