Thomas Workman
12Patents
5h-index
32Co-inventors
66Inventor score
Filing activity: Aug 31, 2000 → Aug 1, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11296053B2 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Electricity | 35 | Active |
| US6724078B1 | Electronic assembly comprising solderable thermal interface | Electricity | 22 | Expired |
| US9501801B2 | One click to update buyer in mass on purchaser orders and prepare changes to communicate to supplier | Physics | 8 | Active |
| US9387505B2 | Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes | Performing Operations; Transporting | 7 | Active |
| US11955463B2 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Electricity | 6 | Active |
| US7091063B2 | Electronic assembly comprising solderable thermal interface and methods of manufacture | Electricity | 5 | Expired |
| US12272677B2 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Electricity | 3 | Active |
| US12191233B2 | Embedded cooling systems and methods of manufacturing embedded cooling systems | Electricity | 1 | Active |
| US12341083B2 | Electronic device cooling structures bonded to semiconductor elements | Electricity | 0 | Active |
| US12080672B2 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Electricity | 0 | Active |
| US10417649B2 | Business process global searching | Physics | 0 | Active |
| US12368087B2 | Embedded cooling systems for advanced device packaging and methods of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.