Integrated heater (and related method) to recover degraded piezoelectric device performance
US12082505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2022 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Oct 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/063
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.