Systems and methods for wafer bond monitoring
US12085518B2 · kind B2 · utility
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2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2023 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Aug 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2021/60292
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.