Pressure sensor manifold with increased photocurable resistance
US12085851B2 · kind B2 · utility
0Cited by
9References
15Claims
0Family size
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Key dates
| Filing date | Sep 28, 2020 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0271
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor manifold is provided that resolves issues caused by accumulated particles and bubbles to improve print head performance. The pressure sensor manifold includes a fluid inlet, a fluid outlet, and a dome-shape cavity connecting with both the fluid inlet and the fluid outlet. The fluid inlet has a first interior cross-section, and the fluid outlet has a second interior cross-section. The dome-shape cavity has an apex. A line that is tangential to the apex passes through a plurality of points on both the first interior cross-section of the fluid inlet and the second interior cross-section of the fluid outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.