Wafer placement table and method of manufacturing the same
US12087613B2 · kind B2 · utility
0Cited by
3References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 10, 2021 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Dec 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer placement table is a ceramic sintered body with a surface provided with multiple projections that support a wafer. Of the surface of the ceramic sintered body, the area provided with no projection is a mirror surface which has a surface roughness Ra of 0.1 μm or less. The projections are formed of an aerosol deposition film or a thermal spray film made of the same material as for the ceramic sintered body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.