Dielectric liners on through glass vias
US12087623B1 · kind B1 · utility
0Cited by
7References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 25, 2024 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 25, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5384
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of improving interfacial adhesion of a copper-glass interface in a Through Glass Via (TGV) of an electronic device includes coating an internal wall of a TGV with a curable polymer material having a viscosity less than 30 Poise. The coating is cured to form a dielectric liner having a tensile strength greater than about 8 Mpa and a dielectric loss less than about 0.002. A layer of copper may then be deposited on the dielectric liner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.