Hybrid thermal interface material (TIM) with reduced 3D thermal resistance
US12087658B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2020 |
| Grant date | Sep 10, 2024 |
| Priority date | — |
| Expiry date | Jan 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid thermal interface material (TIM) suitable for an integrated circuit (IC) die package assembly. The hybrid TIM may include a heat-spreading material having a high planar thermal conductivity, and a supplemental material having a high perpendicular thermal conductivity at least partially filling through-holes within the heat-spreading material. The hybrid TIM may offer a reduced effective spreading and vertical thermal resistance. The heat-spreading material may have high compressibility (low bulk modulus or low hardness), such as a carbon-based (e.g., graphitic) material. The supplemental material may be of a suitable composition for filling the through-hole. The heat-spreading material, once compressed by a force applied through an IC die package assembly, may have a thickness substantially the same as that of the supplemental material such that both materials make contact with the IC die package and a thermal solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.