Package core assembly and fabrication methods

US12087679B2 · kind B2 · utility

Inventors

• Han-Wen Chen · San Mateo, US
• Steven Verhaverbeke · San Francisco, US
• Giback Park · San Jose, US
• Kyuil Cho · Santa Clara, US
• Kurtis Leschkies · San Jose, US
• Roman Gouk · San Jose, US
• Chintan Buch · Santa Clara, US
• Vincent DiCaprio · Pleasanton, US
• Bernhard Stonas · Hayward, US
• Jean Delmas · Santa Clara, US

Key dates

• Filing date: May 28, 2020
• Grant date: Sep 10, 2024
• Expiry date: May 28, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/5385
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.