Inventor · Santa Clara, CA, US

Kyuil Cho

32Patents
3h-index
31Co-inventors
55Inventor score

Filing activity: Oct 31, 2016 → Jul 31, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10211072B2 Method of reconstituted substrate formation for advanced packaging applications Electricity 32 Active
US10886232B2 Package structure and fabrication methods Electricity 11 Active
US11264331B2 Package structure and fabrication methods Electricity 8 Active
US10727083B1 Method for via formation in flowable epoxy materials by micro-imprint Electricity 3 Active
US10937726B1 Package structure with embedded core Electricity 3 Active
US11322381B2 Method for substrate registration and anchoring in inkjet printing Electricity 1 Active
US11367643B2 Method for substrate registration and anchoring in inkjet printing Electricity 1 Active
US11715700B2 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Electricity 1 Active
US11257790B2 High connectivity device stacking Electricity 1 Active
US10547040B2 Energy storage device having an interlayer between electrode and electrolyte layer Emerging Cross-Sectional Technologies 1 Active
US11329003B2 Anchoring dies using 3D printing to form reconstructed wafer Electricity 1 Active
US11264333B2 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Electricity 0 Active
US12374611B2 Package core assembly and fabrication methods Electricity 0 Active
US11742330B2 High connectivity device stacking Electricity 0 Active
US11476202B2 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Electricity 0 Active
US11362307B2 Encapsulation having polymer and dielectric layers for electronic displays Electricity 0 Active
US11388822B2 Methods for improved polymer-copper adhesion Electricity 0 Active
US12388049B2 High connectivity device stacking Electricity 0 Active
US11281094B2 Method for via formation by micro-imprinting Electricity 0 Active
US11887934B2 Package structure and fabrication methods Electricity 0 Active
US12354968B2 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Electricity 0 Active
US11398433B2 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Electricity 0 Active
US11521935B2 Package structure and fabrication methods Electricity 0 Active
US11862546B2 Package core assembly and fabrication methods Electricity 0 Active
US11211439B2 Stretchable polymer and dielectric layers for electronic displays Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.