Apparatus and method of manufacturing interconnect structures
US12091752B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Oct 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53219
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for manufacturing a semiconductor device may include a chamber, a chuck provided in the chamber, and a biased power supply physically connected with the chuck. The apparatus may include a target component provided over the chuck and the biased power supply, and a magnetron assembly provided over the target component. The magnetron assembly may include a plurality of outer magnetrons and a plurality of inner magnetrons, and a spacing between each adjacent magnetrons of the plurality of outer magnetrons may be different from a spacing between each adjacent magnetrons of the plurality of inner magnetrons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.