Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the same
US12094624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2023 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Oct 18, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E40/60
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for fabricating a lamination structure of a second-generation high-temperature superconducting (2G-HTS) tape is provided. Suitable lamination tapes are selected and subjected to local oxidation on side to form a locally oxidized region having a target pattern. The lamination tapes and a to-be-laminated 2G-HTS tape are sequentially arranged, where the locally-oxidized side of each of the lamination tapes faces toward the 2G-HTS tape. The lamination tapes and the to-be-laminated 2G-HTS tape are simultaneously immersed in a molten solder pool, and subjected to reel-to-reel squeezing lamination to form the desired lamination structure. A lamination structure fabricated by the method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.