Wei-Jen Wu
13Patents
3h-index
39Co-inventors
60Inventor score
Filing activity: Sep 29, 1995 → Jan 17, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5702981A | Method for forming a via in a semiconductor device | Emerging Cross-Sectional Technologies | 84 | Expired |
| US9443757B1 | Semiconductor device and method for fabricating the same | Electricity | 7 | Active |
| US9530871B1 | Method for fabricating a semiconductor device | Electricity | 6 | Active |
| US7172948B2 | Method to avoid a laser marked area step height | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6811955B2 | Method for photoresist development with improved CD | Physics | 2 | Expired |
| US9673053B2 | Method for fabricating semiconductor device | Electricity | 1 | Active |
| US11908843B2 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Electricity | 1 | Active |
| US12337348B2 | Ultrasonic transducer | Performing Operations; Transporting | 0 | Active |
| US10414088B2 | Platform structure for use in low-temperature manufacturing of scaffold for use in tissue engineering and method of low-temperature manufacturing scaffold for use in tissue engineering | Performing Operations; Transporting | 0 | Active |
| US12094624B2 | Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11844289B2 | Second generation high-temperature superconducting (2G-HTS) tape and fabrication method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US12406970B2 | Semiconductor package and method of bonding workpieces | Electricity | 0 | Active |
| US12381191B2 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.