Substrate drying apparatus
US12094731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Jun 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aspect of the disclosure provides a substrate drying apparatus. The substrate drying apparatus includes: a gripping part, gripping an outer periphery part of a substrate that is square; a substrate nozzle, ejecting gas to the substrate gripped by the gripping part to dry the substrate; and a gripping part nozzle, ejecting gas to the gripping part to dry the substrate. The substrate nozzle is relatively movable with respect to the substrate in a first direction, and is able to eject the gas in the first direction toward the substrate. The gripping part nozzle is relatively movable with respect to the substrate in the first direction, and is able to eject the gas in a second direction intersecting with the first direction. The gripping part nozzle is disposed behind the substrate nozzle in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.