Protection mechanism and method for protecting wafer and pin
US12094755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2021 |
| Grant date | Sep 17, 2024 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This application provides a protection mechanism and a method for protecting a wafer and a pin. The protection mechanism includes: a drive; a linear unit, connected to the drive, so as to cause a pin to eject a wafer under the action of the drive; a torsion meter, configured to measure a torque of the protection mechanism in a process of ejecting the wafer by the pin; and a control module, configured to receive the torque measured by the torsion meter, and compare the torque with a predetermined value. The torsion meter is disposed between the drive and the linear unit. The to protection mechanism can effectively measure, in real time, a torque generated in a process of ejecting the wafer, and can determine, according to the torque, whether an abnormality occurs in the ejection process, so that an accident such as wafer fragmentation or pin fracturing can be effectively prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.