Patent · US Active

Pressing device for directly or indirectly applying pressure to power-semiconductor components of a power-semiconductor module

US12094797B2 · kind B2 · utility

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0References

18Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Ingo Bogen · Nuremberg, DE
Manuel Noderer · Nuremberg, DE
Alexander Wehner · Nuremberg, DE

Key dates

Filing date	Jun 14, 2022
Grant date	Sep 17, 2024
Priority date	—
Expiry date	Apr 29, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/0603
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A pressing device for indirectly or directly applying pressure to power-semiconductor components of a power-semiconductor module, having a pressing plate, having a pressing nub element which is formed from an elastic material and which has a pressing nub plate and pressing nubs projecting therefrom, and having a receiving device for receiving the pressing nub element, which receiving device has a base plate provided with recesses, wherein the recesses run through the base plate, wherein the pressing nub plate is arranged on the base plate and the pressing nubs run through the recesses and, on the main side of the base plate facing away from the pressing nub plate, project beyond this main side of the base plate, and wherein the pressing nub plate is arranged between the pressing plate and the base plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.