Patent · US Active

Power semiconductor arrangement having a cover facility and method for releasing it

US12096577B1 · kind B1 · utility

0Cited by

1References

7Claims

0Family size

Assignee

SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG · DE

Inventors

Markus Beck · Scotts Valley, US
Sandro Bulovic · Fürth, DE
Thomas Götze · Edenkoben, DE
Alexander Wehner · Nuremberg, DE
Markus Müller · Wegenstetten, CH
Peter Lemke · Munich, DE
Roland Bittner · Ansbach, DE
Christian Zeiler · Pommersfelden, DE
Johannes KLIER · Amberg, DE
Bernd Fischer · Bräunlingen, DE

Key dates

Filing date	May 7, 2024
Grant date	Sep 17, 2024
Priority date	—
Expiry date	May 7, 2044

Classification

Technology area (CPC H)Electricity
CPC primaryH05K5/13
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A power semiconductor arrangement has a switching facility, a housing, having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility. The housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible. A cover facility for covering the first opening is on the housing so as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates with the external second plug-in connecting facility, whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.