Minimal contact packaging for process chamber components
US12100613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2020 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Apr 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of packaged chamber components and methods of packaging chamber components are provided herein. In some embodiments, a packaged chamber component for use in a process chamber includes: an insert having an annular trench disposed about a raised inner portion, wherein the annular trench is disposed between the raised inner portion and an outer lip, wherein a ledge couples the raised inner portion to the outer lip, wherein the ledge includes a first portion and a second portion disposed radially outward of the first portion, and wherein the second portion includes a resting surface that extends upward and radially outward of an upper surface of the first portion; and a chamber component disposed in the annular trench of the insert and supported by the resting surface such that one or more critical surfaces of the chamber component are spaced apart from the insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.