Chip heat dissipating structure, chip structure, circuit board and supercomputing device
US12100636B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Dec 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a metal layer, where the metal layer is covered on the chip. By adding a metal layer on the top of the chip, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip and preventing a large amount of heat from damaging the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.