BITMAIN TECHNOLOGIES INC.
27Patents
27Active
27Granted
53Portfolio score
Filing activity: Sep 4, 2018 → Jul 19, 2024
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD884768S1 | Camera | General | 31 | Active |
| USD906251S1 | PDU power outlet | General | 9 | Active |
| USD915766S1 | Container | General | 5 | Active |
| US11188131B2 | Calculation board power stage circuit, and calculation board | Electricity | 5 | Active |
| USD892753S1 | Heat sink | General | 4 | Active |
| USD973654S1 | Supercomputing device | General | 3 | Active |
| US10455742B2 | Architecture for cryptocurrency mining operation | Electricity | 3 | Active |
| USD964344S1 | Supercomputing device | General | 2 | Active |
| USD979561S1 | Supercomputing device | General | 2 | Active |
| USD1007435S1 | Socket | General | 1 | Active |
| USD1007436S1 | Socket | General | 1 | Active |
| US12429936B2 | Chip power supply circuit and electronic device | Electricity | 0 | Active |
| USD1046843S1 | Data processor | General | 0 | Active |
| US12100636B2 | Chip heat dissipating structure, chip structure, circuit board and supercomputing device | Electricity | 0 | Active |
| US12041745B2 | Case assembly for server and server having same | Electricity | 0 | Active |
| US11196553B2 | Command transmission method and apparatus, electronic device | Electricity | 0 | Active |
| US12133367B2 | PCB heat dissipation assembly and server having same | Electricity | 0 | Active |
| US12235702B2 | Chip, series power supply circuit, data processing device, and computer server | Physics | 0 | Active |
| US12100639B2 | Chip heat dissipation structure, chip structure, circuit board and supercomputing device | Electricity | 0 | Active |
| USD1078666S1 | Power distribution unit | General | 0 | Active |
| US12398698B2 | Wind power generation apparatus | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US12326770B2 | Power supply circuit, chip, and electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11152278B2 | Heat sink, integrated circuit chip and circuit board | Electricity | 0 | Active |
| US12261108B2 | Chip heat dissipating structure, chip structure, circuit board and supercomputing device | Electricity | 0 | Active |
| US12393243B2 | Supercomputing device, in-place detection method for computing power board, and storage medium | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.