Electrically conductive vias and methods for producing same
US12100647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | May 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5384
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.