Patent · US Active

Conductive members for die attach in flip chip packages

US12100678B2 · kind B2 · utility

0Cited by

3References

33Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Christopher Daniel Manack · Flower Mound, US
Salvatore Frank Pavone · Sachse, US
Maricel Fabia Escaño · Angeles, PH
Rafael Jose Lizares Guevara · 708, PH

Key dates

Filing date	Oct 30, 2019
Grant date	Sep 24, 2024
Priority date	—
Expiry date	Oct 30, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In examples, a semiconductor package comprises a semiconductor die having an active surface; a conductive layer coupled to the active surface; and a polyimide layer coupled to the conductive layer. The package also comprises a conductive pillar coupled to the conductive layer and to the polyimide layer; a flux adhesive material coupled to the conductive pillar; and a solder layer coupled to the flux adhesive material. The package further includes a conductive terminal coupled to the solder layer and exposed to a surface of the package, the active surface of the semiconductor die facing the conductive terminal.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.