Hybrid integration of microLED interconnects with ICs
US12101122B2 · kind B2 · utility
0Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2023 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | May 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.