LED chip-to-chip vertically launched optical communications with optical fiber
US12101128B2 · kind B2 · utility
1Cited by
4References
10Claims
0Family size
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Key dates
| Filing date | Sep 1, 2023 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/43
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.