Shield printed wiring board with ground member and ground member
US12101872B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Sep 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided. A shielded printed wiring board with a ground member of the present invention is a shielded printed wiring board with a ground member, including: a substrate film formed by sequentially stacking a base film, a printed circuit including a ground circuit, and an insulating film; a shielding film including a shielding layer and a protective layer laminated on the shielding layer, the shielding film covering the substrate film such that the shielding layer is closer to the substrate film than the protective layer is; and a ground member arranged on the protective layer of the shielding film, the ground member including an external connection member having a first main surface and a second main surface opposite to the first main surface, and having electroconductivity, electroconductive particles disposed on the first main surface side, and an adhesive resin for fixing the electroconductive particles to the first main surface, …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.