Circuit board structure and manufacturing method thereof
US12108530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Oct 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board structure includes a circuit substrate, a first circuit layer, and a second circuit layer. The circuit substrate has a surface and includes at least one conductive structure and at least one patterned circuit layer. The conductive structure is electrically connected to the patterned circuit layer, and an upper surface of the conductive structure is aligned with the surface. The first circuit layer is directly disposed on the surface of the circuit substrate and electrically connected to the conductive structure. A line width of the first circuit layer is less than or equal to 1/4 of a line width of the patterned circuit layer. The second circuit layer is directly disposed on the first circuit layer and electrically connected to the first circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.