Patent · US Active

Adjustable fluid inlet assembly for a substrate processing apparatus and method

US12110588B2 · kind B2 · utility

0Cited by

0References

15Claims

0Family size

Assignee

Picosun Oy · FI

Inventors

Timo Malinen · Espoo, FI
Vaino Kilpi · Sundsberg, FI
Marko PUDAS · Sundsberg, FI

Key dates

Filing date	Nov 21, 2022
Grant date	Oct 8, 2024
Priority date	—
Expiry date	Feb 4, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67126
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A fluid inlet assembly for a substrate processing apparatus includes a fluid inlet pipe configured to pass through a wall of a sealed pressure vessel, a resilient element around the fluid inlet pipe outside the sealed pressure vessel coupling the fluid inlet pipe to the wall, and first and second end parts, the resilient element being coupled therebetween.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.